MTSE 5530 - Integrated Circuit Packaging

3 hours

Basic packaging concepts, materials, fabrication, testing and reliability, as well as the basics of electrical, thermal and mechanical considerations as required for the design and manufacturing of microelectronics packaging. Current requirements and future trends are presented. General review of analytical techniques used in the evaluation and failure analysis of microelectronic packages.

Prerequisite(s): MTSE 5500 or consent of department.